Disco (OTCMKTS:DSCSY) Shares Gap Up – What’s Next?
by Doug Wharley · The Cerbat GemDisco Corp (OTCMKTS:DSCSY – Get Free Report) shares gapped up before the market opened on Friday . The stock had previously closed at $46.02, but opened at $50.62. Disco shares last traded at $49.9760, with a volume of 13,147 shares traded.
Analysts Set New Price Targets
Separately, Zacks Research downgraded shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company’s stock. According to data from MarketBeat, Disco has a consensus rating of “Buy”.
Check Out Our Latest Report on DSCSY
Disco Stock Up 9.3%
The company’s 50 day moving average is $43.99 and its 200 day moving average is $40.63. The firm has a market capitalization of $54.55 billion, a price-to-earnings ratio of 61.33 and a beta of 1.54.
Disco (OTCMKTS:DSCSY – Get Free Report) last released its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The business had revenue of $848.13 million for the quarter, compared to the consensus estimate of $771.53 million. On average, analysts expect that Disco Corp will post 1.07 EPS for the current year.
Disco Company Profile
Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.
Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.