Weekly Analysts’ Ratings Updates for Qualcomm (QCOM)

by · The Markets Daily

Qualcomm (NASDAQ: QCOM) has recently received a number of price target changes and ratings updates:

  • 4/22/2026 – Qualcomm is now covered by Barclays PLC. They set an “underweight” rating and a $130.00 price target on the stock.
  • 4/21/2026 – Qualcomm had its price target lowered by UBS Group AG from $160.00 to $150.00. They now have a “neutral” rating on the stock.
  • 4/17/2026 – Qualcomm was downgraded by BNP Paribas Exane from “outperform” to “neutral”. They now have a $120.00 price target on the stock, down from $180.00.
  • 4/16/2026 – Qualcomm was downgraded by JPMorgan Chase & Co. from “overweight” to “neutral”. They now have a $140.00 price target on the stock, down from $185.00.
  • 3/30/2026 – Qualcomm is now covered by The Goldman Sachs Group, Inc.. They set a “neutral” rating and a $135.00 price target on the stock.
  • 3/27/2026 – Qualcomm had its “hold (c)” rating reaffirmed by Weiss Ratings.
  • 3/26/2026 – Qualcomm had its “market perform” rating reaffirmed by Sanford C. Bernstein. They now have a $140.00 price target on the stock, down from $175.00.
  • 3/16/2026 – Qualcomm had its “sell” rating reaffirmed by Seaport Research Partners. They now have a $100.00 price target on the stock.
  • 3/10/2026 – Qualcomm is now covered by Bank of America Corporation. They set an “underperform” rating and a $145.00 price target on the stock.
  • 2/24/2026 – Qualcomm was upgraded by Loop Capital from “hold” to “buy”. They now have a $185.00 price target on the stock.
  • 2/24/2026 – Qualcomm was upgraded by Wells Fargo & Company from “underweight” to “equal weight”. They now have a $185.00 price target on the stock, up from $135.00.

Qualcomm Increases Dividend

The firm also recently disclosed a quarterly dividend, which will be paid on Thursday, June 25th. Shareholders of record on Thursday, June 4th will be paid a $0.92 dividend. This is a positive change from Qualcomm’s previous quarterly dividend of $0.89. This represents a $3.68 annualized dividend and a yield of 2.7%. The ex-dividend date is Thursday, June 4th. Qualcomm’s dividend payout ratio is currently 73.55%.

Insider Activity at Qualcomm

In other Qualcomm news, EVP Akash J. Palkhiwala sold 2,500 shares of the company’s stock in a transaction that occurred on Monday, April 13th. The stock was sold at an average price of $130.34, for a total value of $325,850.00. Following the sale, the executive vice president owned 30,684 shares in the company, valued at $3,999,352.56. This represents a 7.53% decrease in their ownership of the stock. The transaction was disclosed in a filing with the Securities & Exchange Commission, which is available at this link. The transaction was executed under a pre-arranged Rule 10b5-1 trading plan. Also, EVP Heather S. Ace sold 3,200 shares of the company’s stock in a transaction that occurred on Monday, February 9th. The shares were sold at an average price of $137.00, for a total value of $438,400.00. Following the completion of the sale, the executive vice president owned 16,393 shares in the company, valued at $2,245,841. This represents a 16.33% decrease in their position. Additional details regarding this sale are available in the official SEC disclosure. Insiders sold 9,118 shares of company stock worth $1,233,705 in the last 90 days. Corporate insiders own 0.05% of the company’s stock.

Qualcomm Incorporated is a global semiconductor and telecommunications equipment company headquartered in San Diego, California. Founded in 1985, the company is known for its development of wireless technologies and for playing a central role in the evolution of digital cellular standards, including CDMA and subsequent generations of mobile standards. Qualcomm’s business combines the design and sale of semiconductor products with a patent licensing program for wireless technologies and related intellectual property.

The company’s product portfolio includes system-on-chip (SoC) platforms marketed under the Snapdragon brand, cellular modem and RF front-end components, connectivity solutions for Wi‑Fi and Bluetooth, and processors and platforms aimed at automotive, IoT, networking and edge-computing applications.

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