Disco (OTCMKTS:DSCSY) Reaches New 52-Week High – Here’s What Happened
by Mitch Edgeman · The Markets DailyDisco Corp (OTCMKTS:DSCSY – Get Free Report) shares hit a new 52-week high on Monday . The stock traded as high as $58.00 and last traded at $55.30, with a volume of 2260 shares trading hands. The stock had previously closed at $52.22.
Analysts Set New Price Targets
Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company’s stock. According to MarketBeat, the company presently has an average rating of “Buy”.
View Our Latest Stock Report on Disco
Disco Price Performance
The firm has a market cap of $60.24 billion, a price-to-earnings ratio of 67.72 and a beta of 1.54. The firm has a fifty day simple moving average of $45.41 and a two-hundred day simple moving average of $41.67.
Disco (OTCMKTS:DSCSY – Get Free Report) last issued its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. Disco had a return on equity of 25.27% and a net margin of 30.95%.The business had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Equities analysts anticipate that Disco Corp will post 1.05 earnings per share for the current fiscal year.
About Disco
Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.
Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.