BE Semiconductor Industries (OTCMKTS:BESIY) Hits New 52-Week High – Time to Buy?
by Doug Wharley · The Cerbat GemBE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) reached a new 52-week high on Monday . The stock traded as high as $275.8480 and last traded at $273.40, with a volume of 2665 shares. The stock had previously closed at $270.00.
Analyst Ratings Changes
Several research firms recently weighed in on BESIY. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Citigroup reissued a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a research report on Sunday, January 4th. Finally, Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Five equities research analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the company. According to MarketBeat.com, the company presently has an average rating of “Hold”.
Check Out Our Latest Analysis on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
The firm has a fifty day simple moving average of $220.35 and a 200 day simple moving average of $187.21. The company has a current ratio of 5.55, a quick ratio of 4.88 and a debt-to-equity ratio of 1.22. The stock has a market cap of $19.82 billion, a price-to-earnings ratio of 146.20 and a beta of 1.78.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.