How Motherboards Are Made – MSI Factory Tour!

Working with so many ranges of products and brands, it’s easy to forget how much work actually goes into manufacturing a product, like a motherboard with intricate traces, various MOSFETs, chunks of metal and plastic and seeing how the end product comes about before being shipped around the world and in the hands of the consumer.

To give us an idea, we went to Shenzhen in China to MSI’s factory to see exactly what the process was from start to finish in terms of the newest Z890 Intel-based boards, giving us a first-hand glimpse into how a motherboard is made from the ground up and even after being in the industry for close to two decades, I have to admit, it was a bit of an eye opener.

I’ve toured many factories over the years from case and cooling manufacturers, even down to rival motherboard vendors, but I will admit, the latter was quite some time ago when manufacturers were solely reliant on manual expertise of placing, soldering, and even checking for defects along the way, but at MSI’s factory, it couldn’t have been any different.

With a big onus on automation, we sat down for a briefing about MSI, the new products, and having close discussions with various product managers, representatives from Intel and seeing what was due to be on offer from the new Arrow Lake processors, and their corresponding hardware, which then led us on to the factory floor itself.

MSI had prepared a whole assembly line for us to tour where we were able to witness a MAG Z890 Tomahawk WiFi being made from the ground up. We were given two whole days to see the process, ask as many questions as we wanted, and to get a real in-depth look into the way the boards are manufactured step by step.

Once you enter the factory floor, of which it was only a small snippet of what MSI are able to do, considering that they have the facilities to produce over 1.3 million boards per month, it’s easy to get a sense of the scale of operations and what’s possible and this goes hand in hand with a combination of large, industrial automated machinery, and workers who were more than happy to see us passing by as we made our way down the assembly line.

From end to end, walking the distance of each line would easily take a few minutes, and everything had a clinical sense to it, including getting us dressed up in protective clothing before even entering the facility.

Everything is on a conveyor system that transports the boards from their start point to the end, ready for packaging before being shipped out, and this includes, not only the manufacture, but testing along the way, inspection and so much more.

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So where does it all start?

Motherboards for the most part, and in the simplest terms are a PCB with various components fixed and soldered to it with traces of copper within that connects the various components to each other. It sounds really simple, but it’s anything but.

The PM’s and engineers at MSI work on producing a design based on their many years of experience and templates set out by the likes of AMD and Intel which are loaded onto the systems. This is the start point for all of the industrious machines to read from so that every component is placed in the correct location, in the correct way, with very little room for error, and the automation side of things was something that MSI were extremely keen to promote to us. In the last few years alone, they have increased automation by ten-fold and are keen to progress further so that more products can be made, and in an even faster manner, without slipping in terms of quality.

While automation is important, there is always room, at least for now, for physical people checking along the way, changing reels of capacitors and components and checking once again, even though MSI have invested heavily on inspection machines that can scan a board at intervals along the way, to make sure that there is no room for error.

The PCBs of which are cut to size, start their journey by moving along into essentially what is a large printer. This printer starts by placing solder on one side of the board, using a Solder Paste printer. Essentially what is a conductive ink printer before moving along to the next step which comes down to component placement.

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SMT

This is done using a large machine that has reels upon reels of SMT or surface mount technology components. This ranges from controllers, MOSFETs, chokes and various other chips and components that are placed on the board automatically before being passed through to the next machine, which is the all important reflow process.

During this process, there’s a computer which acts as a manufacturing control system, which allows workers to monitor any issues along the way. This also includes a large screen that gives indications as to the status of each reel so that the reels can be replaced and replenished with more components to keep the steady flow of installation of the various components going. The colour changes as the reels get low giving a clear visual indication as to the status and this is heavily monitored by the workers within the assembly line.

The reflow machine is a large oven where the board, on a conveyor, gets passed along with temperatures reaching up to 250°C. This allows the various SMTs to be adjoined to the board through the solder joints and has a tapered temperature curve that heats up as the board gets towards the end. This process enables a controlled and steady flow of heat, ensuring that the delicate components are not damaged as they pass through the machine. The reflow oven carefully manages temperature gradients, allowing solder to melt and create reliable electrical connections without compromising the integrity of the sensitive components. This meticulous attention to thermal management is crucial for producing high-quality motherboards that perform reliably in their intended applications.

Once this is done, the journey continues, and this is where things get really interesting as MSI utilises AOI machines, or Automatic Optical Inspection. This is a pivotal step in ensuring the quality and reliability of each motherboard produced. The AOI machines employ high-resolution cameras to meticulously scan the boards for any defects that might have occurred during the previous manufacturing stages.

As the boards glide through the inspection area, the AOI system captures detailed images and analyses them using sophisticated algorithms. It checks for correct component placement, verifies solder joint integrity, and identifies any potential surface defects—whether it’s a misaligned capacitor or a missing resistor. This automated process significantly enhances quality control, allowing for immediate detection of issues that could affect performance.

The use of AOI is part of MSI’s commitment to maintaining high manufacturing standards, ensuring that every motherboard meets rigorous specifications before moving on to the next phase of production. This integration of technology not only boosts efficiency but also minimizes the risk of human error, leading to a more consistent and reliable final product.

With the AOI process completed, any flagged boards are either reworked to correct the issues or discarded, ensuring that only the highest quality motherboards proceed to the testing and packaging stages. It’s a clear demonstration of how MSI blends cutting-edge technology with a dedication to craftsmanship, ultimately delivering products that consumers can trust.

The next step involves the board sliding into another solder paste printer, but this time is for the top of the board, and there’s a machine that literally flips the board over before being passed into the solder printer.

The process is similar to the underside of the board, and then moves onto another SMT component placement machine. Again, various chips, controllers, chokes and other essential components are automatically positioned on the surface of the PCB. This machine uses advanced robotics and precision alignment technology to ensure that each component is placed accurately in accordance with the predefined design specifications.

Once the components are in place, the board moves on to the next critical phase: another reflow oven. Here, the solder paste that was applied earlier melts, creating secure electrical connections between the components and the board. The controlled heating process again, is vital, as it ensures that the delicate parts are not damaged while achieving optimal solder joint integrity.

After the reflow, the board undergoes further inspection to verify that all components are properly attached and functioning as intended. This step is essential in maintaining the high standards of quality that MSI is known for, and it lays the groundwork for the final assembly and testing phases, where the board will be rigorously evaluated before reaching consumers.

Following on from that, there’s X-ray inspection, a crucial step that provides a deeper analysis of the motherboard’s assembly. This non-destructive testing method allows technicians to see beneath the surface, examining solder joints and hidden components that are not accessible through visual inspection alone.

X-ray inspection is particularly important for assessing the integrity of BGA (Ball Grid Array) and other components that are soldered on the underside of the PCB. By capturing detailed images, the system can identify issues such as voids in the solder, insufficient solder coverage, or misaligned components, all of which could impact the motherboard’s performance.

This advanced inspection technique complements the previous steps in the manufacturing process, ensuring that any potential defects are caught before the boards move on to final testing and packaging. By utilizing X-ray inspection, MSI reinforces its commitment to delivering high-quality products that meet the demands of both performance and reliability, ultimately providing consumers with motherboards they can trust.

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DIP

In terms of SMT installation, the board is now at a point where that part of the process is complete, and it moves on to the DIP process. This refers to a method of mounting electronic components onto a printed circuit board (PCB). DIP components are characterized by two parallel rows of pins that are inserted into corresponding holes in the PCB. This process includes the installation of various slots and connectors, such as PWM connectors, EPS power connectors, PCI-Express slots, DDR memory slots, and more.

In the DIP process, connectors are efficiently handled by an automated carousel system. This carousel is designed to hold multiple connectors and rotates to deliver them precisely at the right moment for the next stage of production. As the carousel moves, it sequentially feeds the connectors into the placement machine, ensuring a steady and organized supply.

Once the connectors reach the placement machine, they are positioned accurately onto the PCB. This automated method not only enhances the speed of production but also maintains consistency and precision in the placement of each connector. By minimizing manual handling, the carousel system reduces the risk of errors, ultimately contributing to higher quality and reliability in the final product. This streamlined approach is a testament to the sophisticated automation techniques employed in modern motherboard manufacturing.

Throughout our tour, we were fortunate to have various machines opened up for us, allowing us to capture detailed pictures and videos of the inner workings. The workers were incredibly accommodating, taking the time to explain each machine’s function and the technology behind it. This hands-on access provided us with a unique perspective on the complexity and precision involved in the manufacturing process.

Seeing the machines in action, from the intricate placement of components to the automated inspection systems, truly highlighted the level of sophistication in MSI’s production line. The workers’ insights added valuable context, helping us appreciate the meticulous engineering and teamwork that go into producing high-quality motherboards. This opportunity not only enriched our understanding but also emphasized the dedication and expertise of the team behind the scenes.

This also included capacitors, which play a vital role in the functionality of motherboards. During our tour, we were able to see how these components are handled and placed with precision. Capacitors are essential for storing and releasing electrical energy, helping to regulate voltage and filter signals within the circuit. As we watched the machines operate, it was fascinating to see the automated systems accurately position capacitors on the PCB. The workers explained the importance of each capacitor’s specifications, as even minor variations can significantly impact the overall performance and stability of the motherboard. This behind-the-scenes look highlighted not only the complexity of the assembly process but also the critical role that capacitors play in ensuring reliable and efficient operation in computing systems.

These capacitors are, very much like the SMT machines, on a long reel which feeds into the machine at varying intervals and are placed with the utmost precision, again with screens and software that monitor the application along the way.

While automation is key, between these machines were two workers who had to manually place some of the PCI-Express slots and other components, though our guide did make it clear that this part of the process could be automated further down the line, and the workers would instead potentially be put onto inspection duty instead.

As more parts of the manufacturing process are completed and additional soldering applications are performed, a thorough and meticulous cleaning becomes essential. This step is crucial for removing any residual flux, solder debris, and contaminants that may have accumulated during production. A clean PCB ensures optimal performance, as any leftover materials can interfere with electrical connections and lead to potential malfunctions.

To achieve this, specialized cleaning machines are employed, using a combination of solvents and ultrasonic waves to effectively remove impurities without damaging the delicate components. This thorough cleaning process not only enhances the reliability of the motherboards but also prepares them for subsequent testing and inspection.

Further checks are then conducted by another AOI machine, which scans various parts of the board with high-resolution imaging technology. This inspection focuses on verifying the correct placement and alignment of components, ensuring that each piece is positioned precisely according to the design specifications. The AOI system analyses solder joints for integrity and detects any potential defects, such as misalignments or missing components.

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Testing

Then comes the really cool stuff, which utilizes robotic arms to pick the board up and test the various parts. This automated process is facilitated by the DIP-ICT21, an advanced in-circuit testing fixture that connects directly to the PCB. As the robotic arms position the board with precision, a series of probes make contact with specific test points on the circuit, allowing for thorough electrical testing.

The system performs a range of diagnostic checks, assessing the functionality of components and verifying proper connections. This includes measuring voltage levels, checking for shorts or opens, and ensuring that each part operates within its specified parameters. The speed and accuracy of the robotic arms not only enhance testing efficiency but also significantly reduce the likelihood of human error.

By automating this critical phase of testing, manufacturers can quickly identify any defects, ensuring that only fully functional boards proceed to the next stages of production. 

The CPU socket mechanism, designed for secure locking, is then installed onto the motherboard. This essential component ensures that the CPU remains firmly in place, providing a stable connection for optimal performance.

The locking mechanism typically consists of a lever or latch that engages the CPU once it is properly seated in the socket. When the CPU is inserted, the mechanism is closed, applying even pressure to the chip, which helps to maintain electrical integrity and prevent any movement during operation.

This precise installation process is crucial, as any misalignment can lead to poor performance or even damage to the CPU. The careful design of the locking mechanism not only facilitates easy CPU installation and removal but also enhances the overall reliability of the motherboard, ensuring that it can handle the demands of high-performance computing tasks.

The CPU socket mechanism is then securely screwed down, followed by the installation of the chipset heatsink, which is essential for managing thermal performance. To avoid overtightening, a piece of Perspex is used as a spacer, allowing for proper torque without risking damage to the motherboard or the chipset.

The heatsink plays a crucial role in dissipating heat generated during operation, ensuring that temperatures remain within optimal ranges and preventing thermal throttling. This careful installation process highlights the importance of effective thermal management in high-performance computing.

Further checks are conducted using both automated systems and visual inspections to ensure the highest quality standards. This dual approach allows for comprehensive assessments, as the automated systems can quickly identify electrical issues while skilled technicians can spot any physical defects.

Any defective components or discrepancies are addressed at this stage, allowing for timely rework or adjustments before the boards move on to the final stage of production. This proactive quality control not only enhances overall reliability but also ensures that only fully functional motherboards proceed to the final assembly and testing phases.

Speaking of testing phases, this happens next, where a basic yet effective cooler is installed on the motherboard. Following that, all other components, including NVME drives and GPUs, are carefully covered with protective materials such as tape and foam. This step is crucial to prevent any scratches or damage to the boards during the testing process.

By ensuring that every component is well-protected, the manufacturing team minimizes the risk of physical harm that could affect performance or aesthetics. This careful attention to detail demonstrates the commitment to maintaining the quality of the products throughout the testing and assembly phases, ensuring that each motherboard can perform optimally in its final application.

A test is then run using what appeared to be custom software specifically designed for this purpose. This software meticulously checks every aspect of the motherboard’s connectors and performance, assessing functionality and verifying that all components operate as intended.

The testing process includes evaluating signal integrity, power delivery, and data transfer rates, ensuring that each connector meets the required specifications. By employing tailored software, the testing team can efficiently identify any potential issues, again, allowing for immediate adjustments or repairs.

There’s a specific repair area where a dedicated technician works, equipped with a Tektronix TDS2022B oscilloscope and a multimeter, along with various other diagnostic tools. This setup allows the technician to perform detailed analyses and troubleshooting on any motherboards that fail the testing phase.

Using the oscilloscope, the technician can monitor electrical signals in real time, helping to identify issues related to timing or signal integrity. The multimeter complements this by measuring voltage, current, and resistance, providing essential data for diagnosing faults. With these tools at their disposal, the technician meticulously inspects and repairs any defects, ensuring that only fully functional motherboards move on to the final assembly and packaging stages.

There’s even a machine dedicated to scanning all of the socket pins, which, for Intel’s latest products, number an impressive 1,851. This advanced scanning technology ensures that each pin is correctly aligned and free from defects, critical for maintaining the integrity of the CPU connection.

As the motherboard passes through this machine, it conducts a thorough inspection, verifying that all pins are intact and properly positioned. Any discrepancies or damages can be identified and addressed immediately, preventing potential issues that could affect performance. 

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The Finished Product

The I/O plate is then installed, followed by the heatsinks for the VRMs (Voltage Regulator Modules). The I/O plate serves as a protective barrier for the ports and connectors on the motherboard, ensuring they are securely housed and accessible for users.

Once the I/O plate is in place, the heatsinks for the VRMs are mounted to manage heat dissipation effectively and then, a final visual inspection is conducted to ensure that everything is in order before the motherboards pass down the line to packaging. During this inspection, technicians meticulously check for any cosmetic defects, alignment issues, or signs of damage that may have occurred during assembly because while machines can look for tolerance differences and misplacement, a visual eye of a human can be beneficial for checking aesthetics and overall damage.

It’s then boxed up, with accessories carefully included, such as manuals, cables, and other essential components. Each individual box is then placed inside a larger box, stacked neatly to maximize space and protect the contents during transit.

This organized packaging ensures that the motherboards are securely stored and ready for transport to the warehouse. Once packed, the completed units are prepared for shipment, marking the final step in the manufacturing journey before reaching consumers.

Wrapping it all up, our visit to MSI’s factory in Shenzhen was a real eye-opener. Seeing the MAG Z890 Tomahawk WiFi come together from scratch gave us a fresh perspective on the amount of work and technology involved in making a motherboard. From the detailed design phase to the advanced machinery that places every component with pinpoint accuracy, it was impressive to witness the blend of automation and craftsmanship first-hand.

We watched as everything unfolded, from the initial soldering to the automated inspections that ensure each board meets MSI’s high standards. The whole process—cleaning, testing, and finally packaging—showed just how much care goes into making sure each motherboard is ready for the consumer.

Now, the excitement doesn’t stop there, as we’ve got one of these boards in for review so keep an eye out on the 24th October to see how it performs and what all this manufacturing prowess translates to in terms of real-world use because from a first glance, there’s a lot of new features coming to Intel’s latest platform, and MSI are at the forefront of it too.