Samsung wants to turn mobile devices into AI powerhouses

In an increasingly "AI-dense" world, tech companies are all thinking about how they can better integrate AI. For mobile devices, we're seeing AI-powered features and intelligent assistants. But Samsung wants to go one step further and turn smartphones and tablets into AI powerhouses.

High-performance on-device AI

According to ETNews, Samsung is working on a new high-bandwidth memory (HBM) package for mobile devices. This HBM package combines ultra-high aspect ratio copper pillars with Fan-Out Wafer Level Packaging (FOWLP), an upgrade to the existing Vertical Copper Post Stack (VCS) technology. For your info, FOWLP was used to build Samsung's Exynos 2600 chipset.

So, why design a new HBM package? Mainly because Samsung wants to enable high-performance on-device AI in mobile devices. This new package could result in 15% to 30% more bandwidth and provide more than 1.5x memory stacks. Samsung is still developing this new tech for smartphones and tablets. If successful, the company could start using it in its Exynos 2800 or Exynos 2900 chipsets.

2028 debut?

By the way, the Exynos 2700 is expected to enter mass production later this year. Based on the timeline, Samsung's new HBM tech might surface in 2028. It should also be noted that HBM is the type of memory used in AI data centres, so Samsung may have to postpone its debut if its production capacity is maxed out by the AI industry.

What do you think of smartphones potentially turning into super AI generators? Let us know in the comments, and stay tuned to TechNave for more news like this.