BE Semiconductor Industries (OTCMKTS:BESIY) Announces Quarterly Earnings Results, Misses Expectations By $0.01 EPS

by · The Markets Daily

BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) posted its quarterly earnings data on Thursday. The technology company reported $1.29 EPS for the quarter, missing the consensus estimate of $1.30 by ($0.01), Zacks reports. The firm had revenue of $290.52 million for the quarter, compared to analysts’ expectations of $283.73 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

BE Semiconductor Industries Trading Down 8.1%

Shares of BESIY stock opened at $260.74 on Friday. The company has a current ratio of 4.74, a quick ratio of 4.17 and a debt-to-equity ratio of 1.11. BE Semiconductor Industries has a twelve month low of $122.81 and a twelve month high of $374.33. The company’s 50-day moving average price is $315.30 and its 200-day moving average price is $257.89. The stock has a market cap of $18.91 billion, a price-to-earnings ratio of 117.98 and a beta of 1.97.

Wall Street Analyst Weigh In

Several brokerages have issued reports on BESIY. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Zacks Research lowered shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, June 26th. Finally, Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Five research analysts have rated the stock with a Buy rating and four have given a Hold rating to the stock. According to data from MarketBeat.com, the stock currently has a consensus rating of “Moderate Buy”.

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BE Semiconductor Industries Company Profile

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BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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