New AMD Ryzen 7 9800X3D pictures hint at secret to higher clock speeds

With a seemingly flipped 3D V-Cache arrangement, the new X3D gaming CPU allows its cores to be cooled more readily than older X3D designs.

As we build up to the imminent launch of the AMD Ryzen 7 9800X3D, a newly leaked image of the upcoming gaming CPU shows it shorn of its heatspreader, exposing the silicon chips below. This AMD Ryzen 7 9800X3D delid picture in turn hints at a key reason why this CPU is expected to run at higher clock speeds than previous X3D models.

With the AMD Ryzen 7 9800X3D already expected to be the best gaming CPU around when it launches, there are several reasons why it has such a weight of expectation, including it being based on AMD’s latest 9000-series architecture and including an extra stack of L3 cache. However, it could be a new arrangement of its 3D V-Cache that tips it over into truly chart-topping territory.

The delidded CPU image comes via WCCFTech, which doesn’t cite a source for the image; it just states that the site has obtained it. Regardless, what it shows is the familiar arrangement of recent AMD CPUs, where in the center of the substrate sits a single larger silicon chip, which is the CPU’s IO die, then off to the side is another silicon chip and space for a second chip. The latter chip and space are where two core complex dies (CCDs) can sit, with these silicon chips containing the cores of the CPU.

Given that the AMD Ryzen 7 9800X3D is expected to be an eight-core chip, and each CCD of recent AMD CPUs has included eight cores, this is why we only see one CCD in this image of the delidded 9800X3D. In previous X3D chips, the chip containing the 3D V-cache has been placed on top of this chip.

The interesting part, though, is that if we look a bit closer at the surface of this single CCD (below left), it appears to be uniform. This is in contrast to previous X3D chips (below right) where we’ve been able to see clear lines on the surface of the chip that delineate the 3D V-Cache die and the small pieces of filler silicon that are used to support the cache die.

This hints at three possibilities. Either the new cache die is larger than before, and fills the entire top surface of the CCD on which it sits, a new manufacturing method has meant the previously visible filler material is now no longer visible, or AMD has flipped the chip around, putting the cache chip underneath and the CCD on top. It’s this latter option that seems most likely, for a few reasons.

Previous leaks about the AMD Ryzen 7 9800X3D box art and AMD Ryzen 7 9800X3D benchmark performance, have hinted at the chip having “2nd Generation 3D V-Cache Technology,” and “next generation 3D V-Cache Technology.” These leaks also refer to the new cache design bringing “better thermal performance” than previously.

Given that it’s the CCD’s cores that are kicking out the most heat, if these are now placed on top of the 3D V-Cache die, it would potentially allow for them to be cooled more efficiently, in turn allowing the faster clock speeds we’ve also seen rumored arriving with this chip. Specifically, whereas the 7800X3D ticks along at a peak of 5GHz, the 9800X3D is expected to peak at 5.2GHz. That’s not a huge leap but a gain is a gain.

All this is still just speculation, though, with no official word from AMD. Indeed, the only official mention from the company itself so far is a confirmed AMD Ryzen 9000X3D release date, with November 7 being earmarked for a launch. It’s speculated that the 9800X3D will be the only chip launched on this date but again this is unconfirmed.

While we wait to see exactly what this date has in store for us, you can find out the best way to keep your possible new 9000X3D chip cool by taking a look at our best CPU cooler guide.